封装
SIP8 package with industry standard pinout
输入电压
F: 9~36Vdc, G: 18~75Vdc
输出功率
3W
工作温度
-40 ~ +85°C (Refer to "Derating Curve")
效率
High efficiency up to 85%
隔离电压
I/P-O/P: 1.5KVDC
短路保护
Protection type : Continuous, automatic recovery
过载保护
Protection type : Recovers automatically after fault condition is removed
欠压锁定
Start-up voltage: 24Vin : 7.5Vdc ; 48Vin : 15.5Vdc; Shutdown voltage: 24Vin : 6Vdc ; 48Vin : 12Vdc
遥控功能
Power ON: R.C. ~ -Vin open circuit ; Power OFF: R.C. ~ -Vin <1.2V or short
输出电压精度
±1.5%
纹波和噪声
50mVp-p
线性调整率
0.5%
负载调整率
Single output models: ±0.5%, Dual output models: ±1%
开关频率
100KHz (Min.) kHz
隔离电阻
I/P-O/P: 100M Ohms / 500VDC / 25°C / 70% RH MΩ
隔离电容
500pF (Typ.)
平均无故障时间
Single output models: 2800Khrs ; Dual output models: 2100Khrs MIL-HDBK-217F(25°C)
尺寸
21.8*9.2*11.1mm (0.86*0.36*0.44 inch)
重量
4.8g
存储温度
-40 ~ +125°C
相对湿度
20% ~ 90% RH non-condensing %RH
温度漂移
0.03% / °C (0 ~ 85°C) %/°C
焊接温度
1.5mm from case of 1 ~ 3sec./260°C max.
认证
EN55032(CISPR32) Radiated Class A